Page 9 - Nanosystem Fabrication Facility 2018
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Equipment

                                                                         Wafer Stepper System

                                                                         Double-sided Optical Substrate
                                                                         Aligner

                                                                         Substrate Pre-bonding Aligner

                                                                         Anodic Substrate Bonder

                                                                         Multi-purpose UV Exposure System
                                                                         Automated Photoresist Coating Track

                                                                         Advanced Spray Coating System

                                                                         Small-sample Photoresist Coater
                                                                         Precision Temperature-controlled
                                                                         Baking Oven

                                                                         Photoresist Stripping and Developing
                                                                         Wet Processing Station

                                                                         3D Nano Printer



                                                                      Typical Processes Available

                                                                         Mask-to-substrate Alignment
                                                                         Substrate-to-substrate Pre-bonding
                                                                         Alignment

                                                                         Constant Intensity UV Exposure

                                                                         Photoresist Coating and Developing
                                                                         Conformal Resist Coating on Severe
                                                                         Topography

                                                                         Soft and Hard Photoresist Baking

                                                                         Anodic Substrate Bonding
                                                                         Wafer Patterning Rework

                                                                         3D Nano Printing















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